Detailed Information
Cited 0 time in 
Cited 0 time in 
Cited 0 time in
Metadata Downloads
FBG 및 Dielectric Sensor를 이용한 EMC 경화 수축에 관한 연구
- Authors
- 김학성
- Issue Date
- 5-Nov-2020
- Conference Name
- 2020년 한국복합재료학회 추계학술대회
- Files in This Item
- There are no files associated with this item.
- Appears in
Collections - 서울 공과대학 > 서울 기계공학부 > 2. Conference Papers
Items in ScholarWorks are protected by copyright, with all rights reserved, unless otherwise indicated.
Related Researcher
- Kim, Hak Sung
- COLLEGE OF ENGINEERING (SCHOOL OF MECHANICAL ENGINEERING)