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The Effects of Water-Soluble Oragnic Additives on the Rhelogical Behavior of Colloidal Silica Slurry and Its Influence on Wafer Polishing Process
- Authors
- 박재근
- Issue Date
- 4-Jun-2004
- Place
- Sungkyunkwan University, Suwon, Korea
- Conference Name
- International Conference on Crystal Growth And LED Epi and Substrate
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Collections - 서울 공과대학 > 서울 융합전자공학부 > 2. Conference Papers
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