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The Rheological Behavior of Colloidal Silica Slurry and Its Influence on Wafer Polishing Process
- Authors
- 박재근
- Issue Date
- 19-Apr-2004
- Place
- Indiana Convention Center & RCA Dome, Indianapolis, Indiana, USA
- Conference Name
- 106th Annual Meeting & Exposition of the American Ceramic Society
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Collections - 서울 공과대학 > 서울 융합전자공학부 > 2. Conference Papers
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