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Fine Pitch, Low Temperature Solder Bump Formation by using Lift-Off Process
- Authors
- 정용재
- Issue Date
- 10-Dec-1999
- Publisher
- Gintic
- Citation
- Symposium on Advances in Packaging
- Conference Name
- Symposium on Advances in Packaging
- Place
- Singapore
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Collections - 서울 공과대학 > 서울 신소재공학부 > 2. Conference Papers
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Related Researcher
- Chung, Yong Chae
- COLLEGE OF ENGINEERING (SCHOOL OF MATERIALS SCIENCE AND ENGINEERING)