A bow-free freestanding GaN waferopen access
- Authors
- Shim, Jae-Hyoung; Park, Jin-Seong; Park, Jea Gun
- Issue Date
- Jun-2020
- Publisher
- ROYAL SOC CHEMISTRY
- Citation
- RSC ADVANCES, v.10, no.37, pp.21860 - 21866
- Indexed
- SCIE
SCOPUS
- Journal Title
- RSC ADVANCES
- Volume
- 10
- Number
- 37
- Start Page
- 21860
- End Page
- 21866
- URI
- https://scholarworks.bwise.kr/hanyang/handle/2021.sw.hanyang/9770
- DOI
- 10.1039/d0ra01024c
- ISSN
- 2046-2069
- Abstract
- For applications as high-brightness light-emitting-diodes, a bow-free freestanding gallium nitride (GaN) wafer 2 inch in diameter and similar to 185 mu m in thickness was fabricated by process-designing pit and mirror GaN layers grownviahydride-vapor-phase epitaxy, laser lift-off, N-face polishing of the pit GaN layer, and three-step polishing of the mirror GaN layer using 3.0 mu m-, 0.5 mu m-, and 50 nm-diameter diamond abrasives and by inductively-coupled-plasma reactive-ion etching. The considerably large concave shape of the GaN wafer could be decreased by controlling the removal amount of the Ga-face mirror layer during the first step of the polishing process, which approached a bow-free shape or changed with further polishing; this well correlated with the residual stress of the polished GaN wafer.
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