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Showing results 1 to 2 of 2
Micro-Power Generation Characteristics of Thermoelectric Thin Film Devices Processed by Electrodeposition and Flip-Chip Bonding
Shin, Kang-Je; Oh, Tae-Sung
Article
Issue Date
2015
Citation
JOURNAL OF ELECTRONIC MATERIALS, v.44, no.6, pp.2026 - 2033
Publisher
SPRINGER
Thermoelectric Power-Generation Characteristics of a Thin-Film Device Processed by the Flip-Chip Bonding of Bi2Te3 and Sb2Te3 Thin-Film Legs Using an Anisotropic Conductive Adhesive
Shin, Kang-Je; Oh, Tae-Sung
Article
Issue Date
2015
Citation
MATERIALS TRANSACTIONS, v.56, no.10, pp.109 - 114
Publisher
JAPAN INST METALS & MATERIALS
1
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