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Effect of Annealing Environment on the Performance of Sol-Gel-Processed ZrO2 RRAM

Authors
Ha, SeunghyunLee, HyunjaeLee, Won-YongJang, BonghoKwon, Hyuk-JunKim, KwangeunJang, Jaewon
Issue Date
Sep-2019
Publisher
MDPI
Keywords
sol-gel; ZrO2; resistive random-access memory; annealing environment
Citation
ELECTRONICS, v.8, no.9
Journal Title
ELECTRONICS
Volume
8
Number
9
URI
https://scholarworks.bwise.kr/hongik/handle/2020.sw.hongik/1163
DOI
10.3390/electronics8090947
ISSN
2079-9292
Abstract
We investigate the annealing environment effect on ZrO2-based resistive random-access memory (RRAM) devices. Fabricated devices exhibited conventional bipolar-switching memory properties. In particular, the vacuum-annealed ZrO2 films exhibited larger crystallinity and grain size, denser film, and a relatively small quantity of oxygen vacancies compared with the films annealed in air and N-2. These led to a decrease in the leakage current and an increase in the resistance ratio of the high-resistance state (HRS)/low-resistance state (LRS) and successfully improved non-volatile memory properties, such as endurance and retention characteristics. The HRS and LRS values were found to last for 10(4) s without any significant degradation.
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