Improvement of electrical and thermal characteristics of nano-micro epoxy composite
- Authors
- Cho, S.-H.; Kim, Y.-M.; Kwon, J.-H.; Lim, K.-J.; Jung, E.-H.; Lee, H.-K.; Shin, P.-S.
- Issue Date
- 2011
- Publisher
- Korean Institute of Electrical and Electronic Material Engineers
- Keywords
- Epoxy; Nanocomposite; Thermal conductivity; Thermal expansion coefficient
- Citation
- Transactions on Electrical and Electronic Materials, v.12, no.4, pp.160 - 163
- Journal Title
- Transactions on Electrical and Electronic Materials
- Volume
- 12
- Number
- 4
- Start Page
- 160
- End Page
- 163
- URI
- https://scholarworks.bwise.kr/hongik/handle/2020.sw.hongik/20534
- DOI
- 10.4313/TEEM.2011.12.4.160
- ISSN
- 1229-7607
- Abstract
- Polymer nanocomposite has been attracting more attention as a new insulation material because homogeneous dispersion of nano-sized inorganic fillers can improve various properties significantly. In this paper, various kinds of epoxy-based nanocomposites were made, and the AC breakdown strengths of Nano filler and micro-SiO2 filler mixtures of epoxy-based composites were analyzed using sphere-to-sphere electrodes. Moreover, nano- and microfiller combinations were investigated as an approach to practical application of nanocomposite insulation materials. Its composition ratio was 100 (resin):82 (hardener):1.5 (accelerator). AC breakdown tests were performed at room temperature (25°C), 80°C, and 100°C in the vicinity of Tg (90°C). Thermal conductivity was measured using TC-30 © 2011 KIEEME. All rights reserved.
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