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Improvement of electrical and thermal characteristics of nano-micro epoxy composite

Authors
Cho, S.-H.Kim, Y.-M.Kwon, J.-H.Lim, K.-J.Jung, E.-H.Lee, H.-K.Shin, P.-S.
Issue Date
2011
Publisher
Korean Institute of Electrical and Electronic Material Engineers
Keywords
Epoxy; Nanocomposite; Thermal conductivity; Thermal expansion coefficient
Citation
Transactions on Electrical and Electronic Materials, v.12, no.4, pp.160 - 163
Journal Title
Transactions on Electrical and Electronic Materials
Volume
12
Number
4
Start Page
160
End Page
163
URI
https://scholarworks.bwise.kr/hongik/handle/2020.sw.hongik/20534
DOI
10.4313/TEEM.2011.12.4.160
ISSN
1229-7607
Abstract
Polymer nanocomposite has been attracting more attention as a new insulation material because homogeneous dispersion of nano-sized inorganic fillers can improve various properties significantly. In this paper, various kinds of epoxy-based nanocomposites were made, and the AC breakdown strengths of Nano filler and micro-SiO2 filler mixtures of epoxy-based composites were analyzed using sphere-to-sphere electrodes. Moreover, nano- and microfiller combinations were investigated as an approach to practical application of nanocomposite insulation materials. Its composition ratio was 100 (resin):82 (hardener):1.5 (accelerator). AC breakdown tests were performed at room temperature (25°C), 80°C, and 100°C in the vicinity of Tg (90°C). Thermal conductivity was measured using TC-30 © 2011 KIEEME. All rights reserved.
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