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Contact resistance variation in top-contact organic thin-film transistors with the deposition rate of Au source/drain electrodes

Authors
Park, JaehoonKang, Jong MookKim, Dong WookChoi, Jong Sun
Issue Date
1-Sep-2010
Publisher
ELSEVIER SCIENCE SA
Keywords
Organic thin-film transistors; Contact resistance; Vacuum thermal evaporation; Surface current
Citation
THIN SOLID FILMS, v.518, no.22, pp.6232 - 6235
Journal Title
THIN SOLID FILMS
Volume
518
Number
22
Start Page
6232
End Page
6235
URI
https://scholarworks.bwise.kr/hongik/handle/2020.sw.hongik/20716
DOI
10.1016/j.tsf.2010.03.168
ISSN
0040-6090
Abstract
We investigated the effect of the deposition rate of Au source/drain electrodes on the contact resistance of the top-contact organic thin-film transistors (OTFTs). For the formation of source/drain contacts, Au was thermally deposited at the different rates of 0.5, 1.0, 5.0, and 13.0 angstrom/s. With increasing the Au deposition rate, the contact resistance extracted at the gate voltage of -30 V could be reduced from 14 x 10(6) to 2.4 x 10(6) Omega, resulting in the characteristic improvements of the top-contact OTFT. It is also found that the contact resistance significantly affects the off-state currents of the device having the short channel length of 10 pm. The control of the deposition rate of source/drain electrodes is suggested to optimize the contact properties of the top-contact OTFTs as well as the device performance. (C) 2010 Elsevier B.V. All rights reserved.
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