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Effects of organic additives on residual stress and surface roughness of electroplated copper for flexible PCBEffects of organic additives on residual stress and surface roughness of electroplated copper for flexible PCB
- Other Titles
- Effects of organic additives on residual stress and surface roughness of electroplated copper for flexible PCB
- Authors
- Jongsoo Kim; Heesan Kim
- Issue Date
- 2007
- Publisher
- 한국부식방식학회
- Keywords
- flexible printed circuit board; electroplating; copper; additive; residual stress; surface roughness†Corresponding author: heesankim@yahoo.co.kr1. IntroductionIn general; FPCB (Flexible Printed circuit Board) consists of a polyimide film as an insul; flexible printed circuit board; electroplating; copper; additive; residual stress; surface roughness†Corresponding author: heesankim@yahoo.co.kr1. IntroductionIn general; FPCB (Flexible Printed circuit Board) consists of a polyimide film as an insul
- Citation
- CORROSION SCIENCE AND TECHNOLOGY, v.6, no.4, pp.154 - 158
- Journal Title
- CORROSION SCIENCE AND TECHNOLOGY
- Volume
- 6
- Number
- 4
- Start Page
- 154
- End Page
- 158
- ISSN
- 1598-6462
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Related Researcher
- Kim, Hee san
- Science & Technology (Department of Nanomaterials Engineering)