Detailed Information
Cited 0 time in 
Cited 0 time in 
Cited 0 time in
Metadata Downloads
Grounded-moating and shielding for noise-coupling reduction between adjacent packages and MCMS
- Issue Date
- 20-Jun-2005
- Publisher
- JOHN WILEY & SONS INC
- Keywords
- shielding; noise coupling; multichip modules
- Citation
- MICROWAVE AND OPTICAL TECHNOLOGY LETTERS, v.45, no.6, pp.557 - 559
- Journal Title
- MICROWAVE AND OPTICAL TECHNOLOGY LETTERS
- Volume
- 45
- Number
- 6
- Start Page
- 557
- End Page
- 559
- ISSN
- 0895-2477
- Abstract
- In this paper, we propose structures for noise- coupling reduction between adjacent packages and dense multichip modules (MCMs), which are classified as (i) grounded-moating and (ii) shielding structures, and (iii) a combination of them. Good agreeement from a 3D finite-element method (3D-FEM) electromagnetic characterization and experimental verification of each structure are presented. (c) 2005 Wiley Periodicals, Inc.
- Files in This Item
- There are no files associated with this item.
Items in ScholarWorks are protected by copyright, with all rights reserved, unless otherwise indicated.
Related Researcher
- Lee, Jeong Hae
- Engineering (Electronic & Electrical Engineering)