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Reaction between Sn-In solder and under bump metallurgy
- Issue Date
- 2004
- Publisher
- TRANS TECH PUBLICATIONS LTD
- Keywords
- solder; chip on glass; 48Sn-52l; UBM; reflow; intermetallic compound
- Citation
- DESIGNING, PROCESSING AND PROPERTIES OF ADVANCED ENGINEERING MATERIALS, PTS 1 AND 2, v.449-4, pp.401 - 404
- Volume
- 449-4
- Start Page
- 401
- End Page
- 404
- ISSN
- 0255-5476
- Abstract
- Reactions between 48Sn-52In solder and under bump metallurgies(UBM) such as 100nm Ti/8mum Cu and 300nm Al/400nm Ni(V)/400nm Cu have been investigated, and the shear strength of 48Sn-52In solder bumps on each UBM has been evaluated. While intermetallic compounds with two different morphologies were continuously thickened on Ti/Cu with repeating the reflow process, the intermetallics on Al/Ni(V)/Cu spalled into the solder with increasing the number of reflow times. The solder bumps on Ti/Cu exhibited higher shear strength than those on Al/Ni(V)/Cu.
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