Reflow characteristics of Sn-Ag matrix in-situ composite solders

Lee, JH; Park, DJ; Heo, JN; Lee, YH; Shin, DH; Kim, YS

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Reflow characteristics of Sn-Ag matrix in-situ composite solders

Authors: Lee, JH; Park, DJ; Heo, JN; Lee, YH; Shin, DH; Kim, YS

Issue Date: 14-Apr-2000

Publisher: PERGAMON-ELSEVIER SCIENCE LTD

Keywords: reflow soldering; interface reaction; solder; intermetallic; composites

Citation: SCRIPTA MATERIALIA, v.42, no.8, pp.827 - 831

Journal Title: SCRIPTA MATERIALIA

Volume: 42

Number: 8

Start Page: 827

End Page: 831

URI: https://scholarworks.bwise.kr/hongik/handle/2020.sw.hongik/27371

DOI: 10.1016/S1359-6462(99)00392-9

ISSN: 1359-6462

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Appears in Collections: College of Engineering > Materials Science and Engineering Major > 1. Journal Articles

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