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Bump formation and flip chip processes for RF system-on-packages
- Authors
- Jung, Boo-Yang; Choi, Eun-Kyoung; Jeon, Young-Soo; Lee, Kwang-Yong; Seo, Kwang-Seok; Oh, Tae-Sung
- Issue Date
- 2007
- Publisher
- TRANS TECH PUBLICATIONS LTD
- Keywords
- flip chip; SOP; RF package; bump; electronic package
- Citation
- ADVANCES IN NANOMATERIALS AND PROCESSING, PTS 1 AND 2, v.124-126, pp.25 - +
- Volume
- 124-126
- Start Page
- 25
- End Page
- +
- ISSN
- 1012-0394
- Abstract
- For flip-chip process of RF system-on-packages(SOP), double bump bonding processes were investigated. Sn-Ag and Sri solder joints were formed by the reflowed double bumping process, and Sn/In/Sn bump joints were fabricated by the non-reflowed double bump bonding process. The height-to-size ratios of 0.78 and 0.65 were obtained for the reflowed double bumping and the non-reflowed bumping, respectively. Average contact resistance of the reflowed Sn-Ag and Sri solder joints was about 13m Omega which was much lower than 24 similar to 33m Omega of the non-reflowed Sn/In/Sn bump joints. The reflowed solder double bumping method is more suitable for flip-chip process of RF-SOP than the non-reflowed double bump bonding.
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