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Enhanced Interface Characteristics o PA-ALD HfOxNy/InGaAs MOSCAPs Using IPA Oxygen Reactantand Cyclic N-2 Plasma

Authors
Eom, Su-KeunKong, Min-WooKang, Myoung-JinLee, Jae-GilCha, Ho-YoungSeo, Kwang-Seok
Issue Date
Nov-2018
Publisher
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
Keywords
Hafnium oxintride; InGaAs MOS; IPA oxidant; nitridation; inversion
Citation
IEEE ELECTRON DEVICE LETTERS, v.39, no.11, pp.1636 - 1639
Journal Title
IEEE ELECTRON DEVICE LETTERS
Volume
39
Number
11
Start Page
1636
End Page
1639
URI
https://scholarworks.bwise.kr/hongik/handle/2020.sw.hongik/3032
DOI
10.1109/LED.2018.2870176
ISSN
0741-3106
Abstract
This letter reports high-quality plasmaassisted atomic-layer-deposited HfOxNy by using isopropyl alcohol (IPA) oxidant and cyclic N-2 plasma treatment demonstrated on n-type In0.53Ga0.47As. Improved interface characteristics, with suppressed frequency dispersion and surface oxidation, were demonstrated and resulted in significantly decreased interface trap density (D-it) of 4.5 x 10(11) eV(-1) cm(-2) at the mid-gap level with outstanding inversion behaviors. In addition, to verify true inversion, transition frequency (omega(m)) of 4 kHz was extracted. The improvement mechanism of the proposed technology is assumed to be that nitrogen plasma reduces oxygen vacancies that act as oxygen diffusion paths and with the use of IPA oxidant the interface would be strongly protected during pre- and post-dielectric deposition.
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