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계면 스위칭 멤리스터 소자 구조와 신경망 회로 성능에 대한 시뮬레이션 연구Simulation Study of Interfacial Switching Memristor Structure and Neural Network Performance

Other Titles
Simulation Study of Interfacial Switching Memristor Structure and Neural Network Performance
Authors
송윤혁임지민Sagar Khot정동명권용우
Issue Date
Mar-2024
Publisher
대한금속·재료학회
Keywords
Interfacial switching memristor; Schottky barrier height modulation; Synaptic device; Device simulation
Citation
대한금속·재료학회지, v.62, no.3, pp 212 - 221
Pages
10
Journal Title
대한금속·재료학회지
Volume
62
Number
3
Start Page
212
End Page
221
URI
https://scholarworks.bwise.kr/hongik/handle/2020.sw.hongik/32805
DOI
10.3365/KJMM.2024.62.3.212
ISSN
1738-8228
2288-8241
Abstract
In this study, the architecture of an interfacial switching memristor, which has a metal-insulatormetalstructure of Pt/SrTiO3/Nb-SrTiO3 was investigated. The performance of a neural network that usesmemristors as its synapse components was also examined with system-level simulations. A finite elementsolver, COMSOL Multiphysics, was used to simulate synaptic device characteristics, specifically, theconductance change, using a series of pulses for a given architecture. An open-source software, NeuroSim, wasused to simulate the ability of the neural network to recognize and identify handwritten digits. Electrostatics,mass transport, and thermionic emission equations were numerically solved in a fully coupled manner tomodel the Schottky barrier height modulation at the Pt/SrTiO3 contact using the applied bias. The barrierheight is a function of the oxygen vacancy concentration in the SrTiO3 near the contact. The gradual changeof the oxygen vacancy concentration profile caused by successive pulses results in the gradual change ofconductance. Utilizing the simulations, the influences of device structure modification, and more specifically,changing the size of the Schottky contact, on long-term potentiation and depression were analyzed for planardevices. The results show that a smaller Schottky contact yields a higher digit recognition rate. Based on thisfinding, a three-dimensional device architecture that is vertically stackable was designed.
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