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Electroless copper plating for electronics application
Chi, I;
Lee, JH
Article
Issue Date
2001
Citation
PRICM 4: FORTH PACIFIC RIM INTERNATIONAL CONFERENCE ON ADVANCED MATERIALS AND PROCESSING, VOLS I AND II, pp.2291 - 2294
Publisher
JAPAN INST METALS
Study of EDTA complexed electroless copper plating for ULSI and electronics application
Chi, IH;
Lee, JH
Article
Issue Date
2001
Citation
EPD CONGRESS 2001, pp.753 - 760
Publisher
MINERALS, METALS & MATERIALS SOC
1
Discover
Author
Lee, Jae Ho
2
Subject
DEPOSITION
2
METALLIZATION
2
SCALE-INTEGRATION
2
-bipyridyl
1
2,2 &apos
1
EDTA
1
electroless copper plating
1
formaldehyde
1
ULSI
1
Language
English
2
Journal
EPD CONGRESS 2001
1
PRICM 4: FORTH PACIFIC RIM INTERN...
1
BROWSE
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