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Normally-Off MOS-HFET on AlGaN/GaN-on-Si(110) Grown by NH3 MBE

Authors
Han, Sang-WooNoh, YoungkyunJo, Min-GiKim, Seung-HwanOh, Jae-EungSeo, Kwang-SeokCha, Ho-Young
Issue Date
Dec-2016
Publisher
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
Keywords
Gallium nitride; molecular beam epitaxy; GaN-on-Si(110); metal-oxide-semiconductor-heterojunction field-effect transistor; normally-off
Citation
IEEE ELECTRON DEVICE LETTERS, v.37, no.12, pp.1613 - 1616
Journal Title
IEEE ELECTRON DEVICE LETTERS
Volume
37
Number
12
Start Page
1613
End Page
1616
URI
https://scholarworks.bwise.kr/hongik/handle/2020.sw.hongik/7070
DOI
10.1109/LED.2016.2621184
ISSN
0741-3106
Abstract
Due to the difficulty of GaN epitaxy growth on Si(001) substrate, GaN-on-Si wafers are generally grown on Si(111) substrates. Because of the poor electrical characteristics of Si(111) orientation, monolithic integration between CMOS ICs and GaN devices cannot be implemented on GaN-on-Si(111) wafers. At this point of view, Si(110) substrate will be an alternative choice for GaN-on-Si epitaxy growth, because it has good atomic arrangement with AlN seed layer and an advantage of excellent hole mobility characteristics over Si(001). We have developed high quality GaN epitaxy growth technique on Si(110) substrate using NH3 MBE and demonstrated normally-off AlGaN/GaN-on-Si(110) metal-oxide-semiconductor-heterojunction field-effect transistors with an OFF-state breakdown voltage of 610 V. The fabricated device exhibited promising characteristics comparable with those achieved on conventional GaN-on-Si(111) wafers.
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