Contact Resistance Comparison of Flip-Chip Joints Produced with Anisotropic Conductive Adhesive and Nonconductive Adhesive for Smart Textile Applications
- Authors
- Choi, Jung-Yeol; Oh, Tae Sung
- Issue Date
- Oct-2015
- Publisher
- JAPAN INST METALS & MATERIALS
- Keywords
- wearable electronics; smart textile; flip chip; contact resistance; fabric
- Citation
- MATERIALS TRANSACTIONS, v.56, no.10, pp.101 - 108
- Journal Title
- MATERIALS TRANSACTIONS
- Volume
- 56
- Number
- 10
- Start Page
- 101
- End Page
- 108
- URI
- https://scholarworks.bwise.kr/hongik/handle/2020.sw.hongik/9430
- DOI
- 10.2320/matertrans.M2015106
- ISSN
- 1345-9678
- Abstract
- For applications in smart textiles, flip-chip bonding was applied with either an anisotropic conductive adhesive (ACA) or a nonconductive adhesive (NCA) to a heat-resistant fabric and a Si substrate as a reference. The average contact resistances of the flip-chip joints produced with each adhesive on each substrate were evaluated with varying the Cu and Sn thicknesses inversely over the range of 0-15 mu m to maintain a total thickness of 15 mu m of the Cu/Sn bump. The contact resistances of the flip-chip joints produced with ACA on Si, NCA on Si, ACA on fabric, and NCA on fabric were 6.5-12.2 m Omega, 15.6-26.5 m Omega, 5.3-10.2 m Omega, and 5.5-10.1 m Omega, respectively.
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Collections - College of Engineering > Materials Science and Engineering Major > 1. Journal Articles
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