ScholarWorks@Hongik: Journal : Materials Transactions

Materials Transactions

Journal Title

Materials Transactions

ISSN

E 1347-5320 | P 1345-9678 | 1347-5320 | 1345-9678

Publisher

Japan Institute of Metals

Listed on(Coverage)

JCR	2001-2019
SJR	1999-2019
CiteScore	2011-2019
SCI	2010-2019
SCIE	2010-2021
CC	2016-2021
SCOPUS	2017-2020

Active

Active
based on the information
- SCOPUS:2020-10

Country

JAPAN

Aime & Scopes

Being aimed to internationally provide scientific and technological information in the fields of materials and processing from Japan as the Asian core, “Materials Transactions” is collaboratively published with the agreement of the following Institutes. NB: “Materials Transactions” succeeded to “Materials Transactions, JIM” published by The Japan Institute of Metals and Materials.

Homepage

https://www.jstage.jst.go.jp/browse/matertrans/

Article List

1 - 20 out of 20 results.

Accelerated Formation of an Ultrafine-Grained Microstructure in Closed-Cell Aluminum Foam after Extrusion and Differential Speed Rolling

Kim, W. Y.; Kim, W. J.; Utsunomiya, H.

ArticleIssue Date2017CitationMATERIALS TRANSACTIONS, v.58, no.2, pp.291 - 293PublisherJAPAN INST METALS

Effects of Complexing Reagent on Electroless Nickel Iron Alloy Plating for the Diffusion Barrier of UBM

Koo, Ja-Kyung; Lee, Jae-Ho

ArticleIssue Date2017CitationMATERIALS TRANSACTIONS, v.58, no.2, pp.148 - 151PublisherJAPAN INST METALS

Effects of Leveler Concentration in High Aspect Ratio Via Filling in 3D SiP

Jang, Se-Hyun; Yim, Tai-Hong; Song, Young-Sik; Lee, Jae-Ho

ArticleIssue Date2017CitationMATERIALS TRANSACTIONS, v.58, no.2, pp.137 - 139PublisherJAPAN INST METALS

Comparison of Flip-Chip Bonding Characteristics on Rigid, Flexible, and Stretchable Substrates: Part II. Flip-Chip Bonding on Compliant Substrates

Park, Donghyun; Han, Kee-Sun; Oh, Tae Sung

ArticleIssue Date2017CitationMATERIALS TRANSACTIONS, v.58, no.8, pp.1217 - 1222PublisherJAPAN INST METALS & MATERIALS

Comparison of Flip-Chip Bonding Characteristics on Rigid, Flexible, and Stretchable Substrates: Part I. Flip-Chip Bonding on Rigid Substrates

Park, Donghyun; Oh, Tae Sung

ArticleIssue Date2017CitationMATERIALS TRANSACTIONS, v.58, no.8, pp.1212 - 1216PublisherJAPAN INST METALS

Thermoelectric Power-Generation Characteristics of a Thin-Film Device Processed by the Flip-Chip Bonding of Bi2Te3 and Sb2Te3 Thin-Film Legs Using an Anisotropic Conductive Adhesive

Shin, Kang-Je; Oh, Tae-Sung

ArticleIssue Date2015CitationMATERIALS TRANSACTIONS, v.56, no.10, pp.109 - 114PublisherJAPAN INST METALS & MATERIALS

Contact Resistance Comparison of Flip-Chip Joints Produced with Anisotropic Conductive Adhesive and Nonconductive Adhesive for Smart Textile Applications

Choi, Jung-Yeol; Oh, Tae Sung

ArticleIssue Date2015CitationMATERIALS TRANSACTIONS, v.56, no.10, pp.101 - 108PublisherJAPAN INST METALS & MATERIALS

Thermoelectric Characteristics of n-Type Bi2Te3 and p-Type Sb2Te3 Thin Films Prepared by Co-Evaporation and Annealing for Thermopile Sensor Applications

Kim, Jae-Hwan; Choi, Jung-Yeol; Bae, Jae-Man; Kim, Min-Young; Oh, Tae-Sung

ArticleIssue Date2013CitationMATERIALS TRANSACTIONS, v.54, no.4, pp.618 - 625PublisherJAPAN INST METALS

Formation of Through-Silicon-Vias Using Pressure Infiltration of Molten Tin

Kim, Min-Young; Kim, Sung-Kyu; Oh, Tae-Sung

ArticleIssue Date2012CitationMATERIALS TRANSACTIONS, v.53, no.10, pp.1810 - 1815PublisherJAPAN INST METALS & MATERIALS

Thermoelectric Thin Film Device of Cross-Plane Configuration Processed by Electrodeposition and Flip-Chip Bonding

Kim, Min-Young; Oh, Tae-Sung

ArticleIssue Date2012CitationMATERIALS TRANSACTIONS, v.53, no.12, pp.2160 - 2165PublisherJAPAN INST METALS

Thermoelectric Characteristics of the Thermopile Sensors with Variations of the Width and the Thickness of the Electrodeposited Bismuth-Telluride and Antimony-Telluride Thin Films

Kim, Min-Young; Oh, Tae-Sung

ArticleIssue Date2010CitationMATERIALS TRANSACTIONS, v.51, no.10, pp.1909 - 1913PublisherJAPAN INST METALS

Femtosecond Laser Pulse Train Effect on Optical Characteristics and Nonequilibrium Heat Transfer in Thin Metal Films

Sim, Hyung Sub; Park, Seungho; Kim, Tae-Hyoung; Choi, Young Ki; Lee, Joon Sik; Lee, Seong Hyuk

ArticleIssue Date2010CitationMATERIALS TRANSACTIONS, v.51, no.6, pp.1156 - 1162PublisherJAPAN INST METALS & MATERIALS

Wave interference effect in thin film structures under pulsed laser irradiation

Kang, Kwanyu; Lee, Seono Hyuk; Ryou, Hong Sun; Choi, Young Ki; Park, Seungho; Lee, Joon Sik

ArticleIssue Date2008CitationMATERIALS TRANSACTIONS, v.49, no.8, pp.1880 - 1888PublisherJAPAN INST METALS

Contact resistance of the chip-on-glass bonded 48Sn-52In solder joint

Choi, JH; Lee, KY; Jun, SW; Kim, YH; Oh, TS

ArticleIssue Date2005CitationMATERIALS TRANSACTIONS, v.46, no.5, pp.1042 - 1046PublisherJAPAN INST METALS

Grain-size strengthening in equal-channel-angular-pressing processed AZ31 Mg alloys with a constant texture

Kim, WJ; Jeong, HT

ArticleIssue Date2005CitationMATERIALS TRANSACTIONS, v.46, no.2, pp.251 - 258PublisherJAPAN INST METALS

Optimization of hot rolling process of gravity cast AZ31-xCa (x=0-2-0 mass%) alloys

Yim, CD; You, BS; Lee, JS; Kim, WC

ArticleIssue Date2004CitationMATERIALS TRANSACTIONS, v.45, no.10, pp.3018 - 3022PublisherJAPAN INST METALS

Creep deformation mechanisms in coarse-grained solid solution Mg alloys

Chung, SW; Watanabe, H; Kim, WJ; Higashi, K

ArticleIssue Date2004CitationMATERIALS TRANSACTIONS, v.45, no.4, pp.1266 - 1271PublisherJAPAN INST METALS

Spheroidization of low carbon steel processed by equal channel angular pressing

Shin, DH; Han, SY; Park, KT; Kim, YS; Paik, YN

ArticleIssue Date2003CitationMATERIALS TRANSACTIONS, v.44, no.8, pp.1630 - 1635PublisherJAPAN INST METALS

The effect of ram speed on mechanical and thermal properties in ECAE process simulation

Chung, SW; Kim, WJ; Kohzu, M; Higashi, K

ArticleIssue Date2003CitationMATERIALS TRANSACTIONS, v.44, no.5, pp.973 - 980PublisherJAPAN INST METALS

Mechanical properties and shear strength of Sn-3.5Ag-Bi solder alloys

Choi, JW; Cha, HS; Oh, TS

ArticleIssue Date2002CitationMATERIALS TRANSACTIONS, v.43, no.8, pp.1864 - 1867PublisherJAPAN INST METALS

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