Effects of Complexing Reagent on Electroless Nickel Iron Alloy Plating for the Diffusion Barrier of UBM
- Authors
- Koo, Ja-Kyung; Lee, Jae-Ho
- Issue Date
- 2017
- Publisher
- JAPAN INST METALS
- Keywords
- electroless; nickel iron alloy; complexing agent; under bump metallization (UBM); stability
- Citation
- MATERIALS TRANSACTIONS, v.58, no.2, pp.148 - 151
- Journal Title
- MATERIALS TRANSACTIONS
- Volume
- 58
- Number
- 2
- Start Page
- 148
- End Page
- 151
- URI
- https://scholarworks.bwise.kr/hongik/handle/2020.sw.hongik/6932
- DOI
- 10.2320/matertrans.MA201606
- ISSN
- 1345-9678
- Abstract
- Electro and electroless nickel platings have been extensively used as a diffusion barrier in under bump metallization (UBM) or as a surface finish on printed circuit boards (PCB). Even though a thin Ni layer on top of Cu can reduce the interfacial reactions with Sn-rich solders at a low re flow temperature, it may not be so effective when a re flow process is performed at a higher temperature and for a longer period. To provide a more robust diffusion barrier layer than electrodes Ni, electroless NiFe alloy system has been proposed. Since the electroless Ni-Fe plating bath has been rarely studied, the proper baths were not available commercially. In this research, the electroless plating of Ni-Fe alloys was investigated on the basis of complexing reagent. The stability of complexing reagent was studied. The compositions of electroplating layers were analyzed with EDS. The desired Ni-Fe alloy were obtained by controlling the chemical composition of the bath and its operating parameters.
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Collections - College of Engineering > Materials Science and Engineering Major > 1. Journal Articles
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