Comparison of Flip-Chip Bonding Characteristics on Rigid, Flexible, and Stretchable Substrates: Part II. Flip-Chip Bonding on Compliant Substrates
- Authors
- Park, Donghyun; Han, Kee-Sun; Oh, Tae Sung
- Issue Date
- 2017
- Publisher
- JAPAN INST METALS & MATERIALS
- Keywords
- stretchable electronic packaging; wearable device; substrate stiffness; flip chip; contact resistance
- Citation
- MATERIALS TRANSACTIONS, v.58, no.8, pp.1217 - 1222
- Journal Title
- MATERIALS TRANSACTIONS
- Volume
- 58
- Number
- 8
- Start Page
- 1217
- End Page
- 1222
- URI
- https://scholarworks.bwise.kr/hongik/handle/2020.sw.hongik/6962
- DOI
- 10.2320/matertrans.M2017066
- ISSN
- 1345-9678
- Abstract
- The contact resistance and microstructure of the flip-chip joints processed using anisotropic conductive adhesive (ACA) were characterized on flexible printed-circuit-board (FPCB) and stretchable FPCB/polydimethylsiloxane (FPCB/PDMS) substrates. On the FPCB substrate, the contact resistance was remarkably reduced from 56.9 m Omega to 13.3 m Omega when the bonding pressure increased from 10 MPa to 200 MPa. However, at a bonding pressure of 300 MPa, it substantially increased to 74.8 m Omega with an excessive deviation of +/- 37.7 m Omega. On the more compliant FPCB/PDMS substrate, the contact resistance decreased from 43.2 m Omega to 31.2 m Omega when the bonding pressure increased from 10 MPa to 50 MPa. Severe distortion of the FPCB/PDMS substrate occurred at bonding pressures above 50 MPa because of the softness of the PDMS. A more compliant substrate has a lower appropriate bonding pressure for the flip-chip process.
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