Reliable low-temperature die attach process using Ag/Sn/Ag sandwich structure for high-temperature semiconductor devices
DC Field | Value | Language |
---|---|---|
dc.contributor.author | Choi, Jinseok | - |
dc.contributor.author | Choi, Gab Soo | - |
dc.contributor.author | An, Sung Jin | - |
dc.date.available | 2021-04-29T08:41:54Z | - |
dc.date.created | 2020-06-16 | - |
dc.date.issued | 2019-01-24 | - |
dc.identifier.issn | 2045-2322 | - |
dc.identifier.uri | https://scholarworks.bwise.kr/kumoh/handle/2020.sw.kumoh/19103 | - |
dc.description.abstract | A low-cost and eco-friendly die attach process for high temperatures should be developed owing to the expansion of the field of high-temperature applications, such as high-power and high-frequency semiconductors. Pb-based and Au-based systems have been used as conventional die attach materials for high-temperature devices. However, these materials exhibit environmental problems and are expensive. Here, we show that the die attach process using the backside metal of the Ag/Sn/Ag sandwich structure is successfully developed for the mass production of Si devices. It has a low-temperature bonding process (235 degrees C), a high remelting temperature (above 400 degrees C), and rapid bonding time (20 ms). In addition, it exhibits better properties than Au-12Ge and Pb-10Sn backside metals, which are conventional materials for the high-temperature die attach process. After the die bonding process, various reliability tests of Si devices with the Ag/Sn/Ag backside metal structure were performed. | - |
dc.language | 영어 | - |
dc.language.iso | en | - |
dc.publisher | NATURE PUBLISHING GROUP | - |
dc.subject | TRANSIENT LIQUID-PHASE | - |
dc.subject | PB-FREE SOLDER | - |
dc.subject | INTERMETALLIC COMPOUNDS | - |
dc.subject | INTERFACIAL REACTIONS | - |
dc.subject | ALLOYS | - |
dc.subject | GROWTH | - |
dc.title | Reliable low-temperature die attach process using Ag/Sn/Ag sandwich structure for high-temperature semiconductor devices | - |
dc.type | Article | - |
dc.contributor.affiliatedAuthor | An, Sung Jin | - |
dc.identifier.doi | 10.1038/s41598-018-37103-7 | - |
dc.identifier.wosid | 000456553400120 | - |
dc.identifier.bibliographicCitation | SCIENTIFIC REPORTS, v.9 | - |
dc.relation.isPartOf | SCIENTIFIC REPORTS | - |
dc.citation.title | SCIENTIFIC REPORTS | - |
dc.citation.volume | 9 | - |
dc.type.rims | ART | - |
dc.type.docType | Article | - |
dc.description.journalClass | 1 | - |
dc.description.journalRegisteredClass | scie | - |
dc.description.journalRegisteredClass | scopus | - |
dc.relation.journalResearchArea | Science & Technology - Other Topics | - |
dc.relation.journalWebOfScienceCategory | Multidisciplinary Sciences | - |
dc.subject.keywordPlus | TRANSIENT LIQUID-PHASE | - |
dc.subject.keywordPlus | PB-FREE SOLDER | - |
dc.subject.keywordPlus | INTERMETALLIC COMPOUNDS | - |
dc.subject.keywordPlus | INTERFACIAL REACTIONS | - |
dc.subject.keywordPlus | ALLOYS | - |
dc.subject.keywordPlus | GROWTH | - |
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