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태양전지용 실리콘 웨이퍼의 멀티 와이어 쏘잉 시절삭저항력에 관한 연구A Study on Cutting Force during Multi Wire Sawing of Silicon Wafers for Solar Cells
- Other Titles
- A Study on Cutting Force during Multi Wire Sawing of Silicon Wafers for Solar Cells
- Issue Date
- 2016
- Publisher
- 한국기계가공학회
- Keywords
- Multi Wire Sawing Machine(멀티 와이어 쏘잉 장비); Diamond Wire Saw(다이아몬드 와이어 쏘); Cutting Force(절삭력); Silicon Ingot(실리콘 잉곳)
- Citation
- 한국기계가공학회지, v.15, no.3, pp 66 - 71
- Pages
- 6
- Journal Title
- 한국기계가공학회지
- Volume
- 15
- Number
- 3
- Start Page
- 66
- End Page
- 71
- ISSN
- 1598-6721
2288-0771
- Abstract
- Reducing the wafer breakage rate and sawing thinner wafers will decrease the cost of solar cells. This study was carried out in order to identify ways to achieve this goal. In this study, the cutting force characteristics using an ingot tilting-type diamond multi wire-sawing machine were analyzed. The cutting force was analyzed while varying the tilting angles and wire speed. The obtained data were analyzed by classifying the tangential cutting force and the normal cutting force. In this cutting force experiment, the difference between the forces was confirmed; it was found that it rises with increasing the tilting angles and decreases when the wire speed elevates. The resulting value can be utilized as basic data for the determination of an ideal cutting recipe.
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Collections - Department of Mechanical Design Engineering > 1. Journal Articles
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