Microvia Filling with Copper Electroplated with Quaternary Ammonium-Based Leveler: The Evaluation of Convection-Dependent Adsorption Behavior of the Leveler
- Authors
- Lee, Myung Hyun; Lee, Yoonjae; Oh, Jung Hwan; Kim, Young Gyu; Cho, Sung Ki; Kim, Jae Jeong
- Issue Date
- 2017
- Publisher
- ELECTROCHEMICAL SOC INC
- Citation
- JOURNAL OF THE ELECTROCHEMICAL SOCIETY, v.164, no.14, pp D1051 - D1055
- Journal Title
- JOURNAL OF THE ELECTROCHEMICAL SOCIETY
- Volume
- 164
- Number
- 14
- Start Page
- D1051
- End Page
- D1055
- URI
- https://scholarworks.bwise.kr/kumoh/handle/2020.sw.kumoh/26985
- DOI
- 10.1149/2.0121802jes
- ISSN
- 0013-4651
1945-7111
- Abstract
- In this study, we synthesized a leveler that contained two quaternary ammonium groups attached to hexaethylene glycol. The leveler enabled void- and seam-less Cu filling of the microvia. The convection-dependent adsorption of the leveler was assessed through electrochemical analyses such as linear sweep voltammetry and chronoamperometry on a rotating disk electrode, and the effect of convection on the adsorption of the leveler is interpreted in terms of adsorption diffusion model. In a Koutecky-Levich plot, the enhanced adsorption and inhibition of the leveler at the higher convection was clearly observed with the synthesized leveler. (c) 2017 The Electrochemical Society.
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