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반도체 Wafer용 Grinder의 안정화 설계Design alterations of a grinder of semiconductor wafer for the improved stability
- Other Titles
- Design alterations of a grinder of semiconductor wafer for the improved stability
- Issue Date
- Jan-2017
- Publisher
- 한국반도체디스플레이기술학회
- Keywords
- Disc surface grinder; Dynamic Properties; Design Alterations; Vibration Control; Stability improvement
- Citation
- 반도체디스플레이기술학회지, v.16, no.1, pp 91 - 96
- Pages
- 6
- Journal Title
- 반도체디스플레이기술학회지
- Volume
- 16
- Number
- 1
- Start Page
- 91
- End Page
- 96
- ISSN
- 1738-2270
- Abstract
- One of the most critical aspects of the modern semiconductor industry is the quality of wafer surface, the roughness of which is mostly caused by the ingot slicing. And the grinding is supposed to be the main process to reduce the surface roughness. The vibrations of the disc surface grinder are the major problem to effectively achieve the required surface quality. In this study, the structure of a disc surface grinder was analyzed through the experiment and the computer simulation to investigate the dynamic characteristics of the machine, and further to alter the design for the improved stability. The result of the study shows that simple design alterations without alternating main body can effectively suppress the vibrations of the machine.
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