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Ti 쇼트키 배리어 다이오드의 Al 확산 방지를 위한 SC-1 세정 효과
최진석; 최여진;
안성진
Article
Issue Date
2021
Citation
한국재료학회지, v.31, no.2, pp.97 - 100
Publisher
한국재료학회
다이 및 와이어 본딩 공정을 위한 Sn-Sb Backside Metal의 계면 구조 및 전단 강도 분석
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최여진; 백승문; 이유나;
안성진
Article
Issue Date
2024
Citation
한국재료학회지, v.34, no.3, pp 170 - 174
Publisher
한국재료학회
1
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Author
최여진
2
백승문
1
이유나
1
최진석
1
Subject
Al diffusion
1
ALLOYS
1
backside metal
1
die attach
1
INTERFACIAL REACTIONS
1
nanomaterials
1
PB-FREE SOLDER
1
POWER ELECTRONICS
1
SC-1
1
Schottky barrier diode
1
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2021
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