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Ag/Sn/Ag 샌드위치 구조를 갖는 Backside Metallization을 이용한 고온 반도체 접합 기술
최진석;
안성진
Article
Issue Date
2020
Citation
마이크로전자 및 패키징학회지, v.27, no.1, pp.1 - 7
Publisher
한국마이크로전자및패키징학회
1
Discover
Author
An, sung jin
1
최진석
1
Subject
backside metallization
1
die attach
1
high-temperature semiconductor
1
soldering
1
Date Issued
2020
1
Type
Article
1
Language
Korean
1
Journal
마이크로전자 및 패키징학회지
1
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