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Effect of fluoroethylene carbonate on electrochemical battery performance and the surface chemistry of amorphous MoO2 lithium-ion secondary battery negative electrodes

Park, Jongwoo; Choi, Insoo; Lee, Min Jeong; Kim, Myeong Ho; Lim, Taeho; Park, Kern H.; Jang, Jihyun; Oh, Seung M.; Cho, Sung Ki; Kim, Jae Jeong

ArticleIssue Date2014CitationELECTROCHIMICA ACTA, v.132, pp 338 - 346PublisherPERGAMON-ELSEVIER SCIENCE LTD

Bottom-up Filling of TSV-Scaled Trenches by Using Step Current Electrodeposition

Kim, Hoe Chul; Kim, Myung Jun; Seo, Youngran; Lee, Yoonjae; Choe, Seunghoe; Kim, Young Gyu; Cho, Sung Ki; Kim, Jae Jeong

ArticleIssue Date2015CitationECS ELECTROCHEMISTRY LETTERS, v.4, no.10, pp D31 - D34PublisherELECTROCHEMICAL SOC INC

Electrochemical Behavior of Citric Acid and Its Influence on Cu Electrodeposition for Damascene Metallization

Kim, Myung Jun; Choe, Seunghoe; Kim, Hoe Chul; Cho, Sung Ki; Kim, Soo-Kil; Kim, Jae Jeong

ArticleIssue Date2015CitationJOURNAL OF THE ELECTROCHEMICAL SOCIETY, v.162, no.8, pp D354 - D359PublisherELECTROCHEMICAL SOC INC

Galvanostatic bottom-up filling of TSV-like trenches: Choline-based leveler containing two quaternary ammoniums

Kim, Myung Jun; Seo, Youngran; Kim, Hoe Chul; Lee, Yoonjae; Choe, Seunghoe; Kim, Young Gyu; Cho, Sung Ki; Kim, Jae Jeong

ArticleIssue Date2015CitationELECTROCHIMICA ACTA, v.163, pp 174 - 181PublisherPERGAMON-ELSEVIER SCIENCE LTD

Voltammetric Observation of Transient Catalytic Behavior of SPS in Copper Electrodeposition-Its Interaction with Cuprous Ion from Comproportionation

Cho, Sung Ki; Kim, Hoe Chul; Kim, Myung Jun; Kim, Jae Jeong

ArticleIssue Date2016CitationJOURNAL OF THE ELECTROCHEMICAL SOCIETY, v.163, no.8, pp D428 - D433PublisherELECTROCHEMICAL SOC INC

Microvia Filling with Copper Electroplated with Quaternary Ammonium-Based Leveler: The Evaluation of Convection-Dependent Adsorption Behavior of the Leveler

Lee, Myung Hyun; Lee, Yoonjae; Oh, Jung Hwan; Kim, Young Gyu; Cho, Sung Ki; Kim, Jae Jeong

ArticleIssue Date2017CitationJOURNAL OF THE ELECTROCHEMICAL SOCIETY, v.164, no.14, pp D1051 - D1055PublisherELECTROCHEMICAL SOC INC

Effect of Halides on Cu Electrodeposit Film: Potential-Dependent Impurity Incorporation

Lee, Won-Hee; Byun, Jinuk; Cho, Sung Ki; Kim, Jae Jeong

ArticleIssue Date2017CitationJOURNAL OF THE ELECTROCHEMICAL SOCIETY, v.164, no.7, pp D493 - D497PublisherELECTROCHEMICAL SOC INC

Electrochemically Identified Ultrathin Water-Oxidation Catalyst in Neutral pH Solution Containing Ni2+ and Its Combination with Photoelectrode

Cho, Sung Ki; Chang, Jinho

ArticleIssue Date2017CitationACS OMEGA, v.2, no.2, pp 432 - 442PublisherAMER CHEMICAL SOC

The Evaluation of Polarized Dynamic Reference Electrode (p-Dyn RE) for LiCl-1 wt% Li2O Molten Salt at 650 degrees C: Li+/Li p-Dyn RE versus O-2/O2- p-Dyn RE

Cho, Sung Ki; Lee, Sang-Kwon; Choi, Eun-Young; Hur, Jin-Mok

ArticleIssue Date2016CitationJOURNAL OF THE ELECTROCHEMICAL SOCIETY, v.163, no.10, pp E308 - E312PublisherELECTROCHEMICAL SOC INC

A Study on the Deposit Uniformity and Profile of Cu Electroplated in Miniaturized, Laboratory-Scale Through Mask Plating Cell for Printed Circuit Board (PCBs) Fabrication

Cho, Sung Ki; Kim, Jae Jeong

ArticleIssue Date2016CitationKOREAN CHEMICAL ENGINEERING RESEARCH, v.54, no.1, pp 108 - 113PublisherKOREAN INSTITUTE CHEMICAL ENGINEERS

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