EPA ECC: Error-Pattern-Aligned ECC for HBM2E
- Authors
- Kwon, K.[Kwon, Kiheon]; Kim, D.[Kim, Dongwhee]; Park, S.[Park, Soyoung]; Kim, J.[Kim, Jungrae]
- Issue Date
- 2023
- Publisher
- Institute of Electrical and Electronics Engineers Inc.
- Keywords
- ECC; HBM2E; on-die ECC; reliability
- Citation
- 2023 International Technical Conference on Circuits/Systems, Computers, and Communications, ITC-CSCC 2023
- Indexed
- SCOPUS
- Journal Title
- 2023 International Technical Conference on Circuits/Systems, Computers, and Communications, ITC-CSCC 2023
- URI
- https://scholarworks.bwise.kr/skku/handle/2021.sw.skku/108465
- DOI
- 10.1109/ITC-CSCC58803.2023.10212882
- ISSN
- 0000-0000
- Abstract
- DRAM vendors introduced On-Die Error Correction Codes (OD-ECC) to correct errors internally. Most OD-ECCs are based on Single Error Correction to correct individual bit errors. However, recent soft error experiments on HBM2 reveal that DRAM frequently experiences multi-bit errors, necessitating a stronger OD-ECC solution. This paper introduces a novel OD-ECC, EPA ECC, specifically designed to correct frequently-observed multi-bit error patterns. The key innovation of EPA ECC is the construction of multi-bit symbols aligned with common error patterns, and the application of Reed-Solomon codes to correct severe errors without increasing the redundancy ratio. Our evaluation demonstrates that EPA ECC provides higher memory reliability than the current SEC-DED OD-ECC without incurring significant system performance degradation. © 2023 IEEE.
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- Appears in
Collections - Information and Communication Engineering > School of Electronic and Electrical Engineering > 1. Journal Articles
- Computing and Informatics > Computer Science and Engineering > 1. Journal Articles
- Information and Communication Engineering > Department of Semiconductor Systems Engineering > 1. Journal Articles
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