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EPA ECC: Error-Pattern-Aligned ECC for HBM2E

Authors
Kwon, K.[Kwon, Kiheon]Kim, D.[Kim, Dongwhee]Park, S.[Park, Soyoung]Kim, J.[Kim, Jungrae]
Issue Date
2023
Publisher
Institute of Electrical and Electronics Engineers Inc.
Keywords
ECC; HBM2E; on-die ECC; reliability
Citation
2023 International Technical Conference on Circuits/Systems, Computers, and Communications, ITC-CSCC 2023
Indexed
SCOPUS
Journal Title
2023 International Technical Conference on Circuits/Systems, Computers, and Communications, ITC-CSCC 2023
URI
https://scholarworks.bwise.kr/skku/handle/2021.sw.skku/108465
DOI
10.1109/ITC-CSCC58803.2023.10212882
ISSN
0000-0000
Abstract
DRAM vendors introduced On-Die Error Correction Codes (OD-ECC) to correct errors internally. Most OD-ECCs are based on Single Error Correction to correct individual bit errors. However, recent soft error experiments on HBM2 reveal that DRAM frequently experiences multi-bit errors, necessitating a stronger OD-ECC solution. This paper introduces a novel OD-ECC, EPA ECC, specifically designed to correct frequently-observed multi-bit error patterns. The key innovation of EPA ECC is the construction of multi-bit symbols aligned with common error patterns, and the application of Reed-Solomon codes to correct severe errors without increasing the redundancy ratio. Our evaluation demonstrates that EPA ECC provides higher memory reliability than the current SEC-DED OD-ECC without incurring significant system performance degradation. © 2023 IEEE.
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Information and Communication Engineering > School of Electronic and Electrical Engineering > 1. Journal Articles
Computing and Informatics > Computer Science and Engineering > 1. Journal Articles
Information and Communication Engineering > Department of Semiconductor Systems Engineering > 1. Journal Articles

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