Kang, J.[Kang, J.]; Park, Y.[Park, Y.]; Hwang, J.[Hwang, J.]; Hong, K.[Hong, K.]; Son, I.[Son, I.]; Chun, J.[Chun, J.]; Choi, J.[Choi, J.]; Kim, S.[Kim, S.]
ArticleIssue Date2022CitationIEEE Solid-State Circuits Letters, v.5, pp.284 - 287PublisherInstitute of Electrical and Electronics Engineers Inc.