Lee, S.[Lee, S.]; Huynh, H.A.[Huynh, H.A.]; Han, Y.[Han, Y.]; Choi, D.[Choi, D.]; Kim, S.[Kim, S.]
ArticleIssue Date2019Citation2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility, EMC Sapporo/APEMC 2019, pp.266 - 269PublisherInstitute of Electrical and Electronics Engineers Inc.