Expedient floating process for ultra-thin InGaZnO thin-film-transistors and their high bending performance
- Authors
- Kang W.J.[Kang W.J.]; Ahn C.H.[Ahn C.H.]; Yun M.G.[Yun M.G.]; Cho S.W.[Cho S.W.]; Kim Y.K.[Kim Y.K.]; Kim D.E.[Kim D.E.]; Kim B.[Kim B.]; Cho H.K.[Cho H.K.]; Kim Y.[Kim Y.]
- Issue Date
- 2016
- Citation
- RSC Advances, v.6, no.68, pp.63418 - 63424
- Indexed
- SCOPUS
- Journal Title
- RSC Advances
- Volume
- 6
- Number
- 68
- Start Page
- 63418
- End Page
- 63424
- URI
- https://scholarworks.bwise.kr/skku/handle/2021.sw.skku/38683
- DOI
- 10.1039/c6ra06372a
- Abstract
- Recently, much attention has been focused on the development of devices with ultra-thin sample thickness for imperceptible and patchable applications, but the use of inorganic active films in flexible electronics has seen a great obstacle due to brittle mechanical properties during bending, despite better electrical performance and high stability. We report a procedure for fabricating organic electronic devices on ultra-thin polymer substrates using a floating process. This process uses water soluble polyvinyl alcohol (PVA) as a sacrificial layer and the maximum process temperature is increased until around 200 °C, which is a valuable condition for high-quality InGaZnO channels and Al2O3 gate dielectrics. The 400 nm PVA coating produced with low molecular weight characteristics had relatively smooth surface roughness and quick floating process. The ultra-thin InGaZnO TFT showed good transfer and reproducible performance under extreme bending conditions due to the use of ultra-thin compliant substrates. © 2016 The Royal Society of Chemistry.
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Collections - Engineering > School of Advanced Materials Science and Engineering > 1. Journal Articles
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