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Pad shape effects on high frequency signal transfer characteristics
- Authors
- Nam, K.-H.[Nam, K.-H.]; Koh, E.-K.[Koh, E.-K.]; Hong, E.-J.[ Hong, E.-J.]; Park, S.-H.[ Park, S.-H.]; Lee, J.-Y.[ Lee, J.-Y.]; Kwak, I.-G.[ Kwak, I.-G.]; Nah, W.[Nah, W.]
- Issue Date
- 2008
- Citation
- 2008 Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2008 - Proceedings, pp.117 - 119
- Journal Title
- 2008 Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2008 - Proceedings
- Start Page
- 117
- End Page
- 119
- Abstract
- As one of the interconnects between board to board, pads on the boards could have considerable effects on high frequency signal transfer characteristics. In this paper, pad shape effects on the signal integrity is analyzed using add-in card model by simulation, and a test fixture designed and fabricated to test to a Serial-ATA cable is used to measure the effect of pad length on high frequency signal transfer characteristics. From the simulation and measurement, it is confirmed that the pads make a considerable effects on the signal transfer characteristics, especially in high frequency range, and we need to carefully design the characteristic impedance of the pads. © 2008 IEEE.
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Related Researcher
- NAH, WAN SOO
- Information and Communication Engineering (Electronic and Electrical Engineering)