Thermal management of microelectronic devices using micro-hole cellular structure and nanofluids
- Authors
- Tariq, HA[Tariq, Hussain Ahmed]; Shoukat, AA[Shoukat, Ahmad Adnan]; Hassan, M[Hassan, Muhammad]; Anwar, M[Anwar, Muhammad]
- Issue Date
- Jun-2019
- Publisher
- SPRINGER
- Keywords
- Micro-hole cellular structure; Nanofluids; Base temperature; Convective heat transfer; Enhancement in thermal conductivity
- Citation
- JOURNAL OF THERMAL ANALYSIS AND CALORIMETRY, v.136, no.5, pp.2171 - 2182
- Indexed
- SCIE
SCOPUS
- Journal Title
- JOURNAL OF THERMAL ANALYSIS AND CALORIMETRY
- Volume
- 136
- Number
- 5
- Start Page
- 2171
- End Page
- 2182
- URI
- https://scholarworks.bwise.kr/skku/handle/2021.sw.skku/9794
- DOI
- 10.1007/s10973-018-7852-0
- ISSN
- 1388-6150
- Abstract
- We investigated the thermal performance of micro-hole cellular structure using Al2O3-H2O and CuO-H2O nanofluids with 0.67% and 0.4%, respectively, of volumetric concentration numerically and then validated these numerical results with the experimental results at a heating power of 345W. We found that the thermal conductivities of Al2O3-H2O and CuO-H2O nanofluids were enhanced by 2% and 1.19%, respectively, as compared to the base fluid (water). Using Al2O3-H2O nanofluids, we achieved the minimum base temperature of 24.5 degrees C and 26.6 degrees C numerically and experimentally, respectively, for the micro-hole cellular structure. Using CuO-H2O nanofluids, we achieved the minimum base temperature of 25.5 degrees C and 27.7 degrees C numerically and experimentally, respectively. The estimated errors between obtained numerical and experimental results were 8.8% and 8.5% for Al2O3-H2O and CuO-H2O, respectively. Experimentally, we achieved the lowest base temperature of 26.6 degrees C and 27.7 degrees C using Al2O3-H2O and CuO-H2O nanofluids, respectively, which was about 17.6% and 14.5% lower than the reported temperature value of 32.3 degrees C using water (Tariq et al. in Therm Sci, 2018. http://www.doiserbia.nb.rs/Article.aspx?ID=0354-98361800184T).
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Collections - Engineering > School of Mechanical Engineering > 1. Journal Articles
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