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Development of a novel meso-scale vapor compression refrigeration system (mVCRS)

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dc.contributor.authorSung, Taijong-
dc.contributor.authorLee, Donghun-
dc.contributor.authorKim, Hwa Soo-
dc.contributor.authorKim, Jongwon-
dc.date.available2018-05-09T11:09:14Z-
dc.date.created2018-04-17-
dc.date.issued2014-05-
dc.identifier.issn1359-4311-
dc.identifier.urihttp://scholarworks.bwise.kr/ssu/handle/2018.sw.ssu/10067-
dc.description.abstractThis paper presents a novel meso-scale vapor compression refrigeration system (mVCRS) consisting of an evaporator, a compressor, a condenser and an expansion nozzle. First, the micro channel evaporator is designed in order to ensure the robustness to the flow rate as well as the cooling load. The film-wise condenser is then built to increase the convective heat transfer coefficient between heat pipes and the refrigerant. In spite of its compact size, the proposed rotary vane type meso-scale compressor can achieve the high pressure ratio of 3.07 and the large flow rate of 10 L per minute (LPM), respectively. The passive type expansion nozzle is adopted due to its simplicity in this research and designed to maintain a constant superheat at the outlet of the evaporator. By tactfully stacking all components, the meso-scale vapor compression refrigeration system is successfully constructed, whose overall size is 60 x 60 x 100 mm(3) (width x length x height). Through extensive experiments, it is validated that the proposed mVCRS can keep the temperature of heat source around 46 degrees C with the maximum cooling capacity of 80 W, and that the average coefficient of performance (COP) is up to 2.15. (C) 2014 Elsevier Ltd. All rights reserved.-
dc.publisherPERGAMON-ELSEVIER SCIENCE LTD-
dc.relation.isPartOfAPPLIED THERMAL ENGINEERING-
dc.subjectMULTI-VANE EXPANDERS-
dc.subjectOPTIMAL-DESIGN-
dc.subjectHEAT-TRANSFER-
dc.subjectELECTRONICS-
dc.subjectEVAPORATOR-
dc.subjectCOOLER-
dc.titleDevelopment of a novel meso-scale vapor compression refrigeration system (mVCRS)-
dc.typeArticle-
dc.identifier.doi10.1016/j.applthermaleng.2014.02.037-
dc.type.rimsART-
dc.identifier.bibliographicCitationAPPLIED THERMAL ENGINEERING, v.66, no.1-2, pp.453 - 463-
dc.description.journalClass1-
dc.identifier.wosid000336352000046-
dc.identifier.scopusid2-s2.0-84896524870-
dc.citation.endPage463-
dc.citation.number1-2-
dc.citation.startPage453-
dc.citation.titleAPPLIED THERMAL ENGINEERING-
dc.citation.volume66-
dc.contributor.affiliatedAuthorLee, Donghun-
dc.type.docTypeArticle-
dc.subject.keywordAuthorMeso-scale-
dc.subject.keywordAuthorVapor compression refrigeration system-
dc.subject.keywordAuthorVane type compressor-
dc.subject.keywordAuthorCoefficient of performance (COP)-
dc.subject.keywordPlusMULTI-VANE EXPANDERS-
dc.subject.keywordPlusOPTIMAL-DESIGN-
dc.subject.keywordPlusHEAT-TRANSFER-
dc.subject.keywordPlusELECTRONICS-
dc.subject.keywordPlusEVAPORATOR-
dc.subject.keywordPlusCOOLER-
dc.description.journalRegisteredClassscie-
dc.description.journalRegisteredClassscopus-
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