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Module design using 2-layers PCB for an automotive BLDC motor driver

Authors
Kim, C.-G.Lee, T.-H.Kim, S.-K.Jeon, J.-Y.Wee, J.-K.
Issue Date
2008
Citation
2008 Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2008, pp.109 - 112
URI
http://scholarworks.bwise.kr/ssu/handle/2018.sw.ssu/33587
DOI
10.1109/EDAPS.2008.4736011
Conference Name
2008 Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2008
Place
Seoul
Conference Date
2008-12-10
ISBN
9781424426331
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College of Information Technology > ETC > 2. Conference Papers

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