Leakage Current Control of SrTiO3 Thin Films through Al Doping at the Interface between Dielectric and Electrode Layers via Atomic Layer Deposition
- Authors
- Kim, Sang Hyeon; Lee, Woongkyu; An, Cheol Hyun; Kim, Yumin; Kwon, Dae Seon; Kim, Dong-Gun; Cha, Soon Hyung; Cho, Seong Tak; Lim, Junil; Hwang, Cheol Seong
- Issue Date
- Nov-2019
- Publisher
- WILEY-V C H VERLAG GMBH
- Keywords
- Al-doping; atomic layer deposition; dielectric constant; leakage current; SrTiO3
- Citation
- PHYSICA STATUS SOLIDI-RAPID RESEARCH LETTERS, v.13, no.11
- Journal Title
- PHYSICA STATUS SOLIDI-RAPID RESEARCH LETTERS
- Volume
- 13
- Number
- 11
- URI
- http://scholarworks.bwise.kr/ssu/handle/2018.sw.ssu/42531
- DOI
- 10.1002/pssr.201900373
- ISSN
- 1862-6254
- Abstract
- Al is doped to a SrTiO3 (STO) thin film grown by atomic layer deposition (ALD) to decrease the leakage current. One ALD cycle of Al2O3 is processed either at the top or at the bottom of the STO films, and the electrical properties are compared with those of the undoped STO films. The approximate to 3.5 nm-thick seed layer is first deposited and crystallized through rapid thermal annealing, and from 5 to 20 nm-thick main layers are subsequently grown for in situ crystallization of the main layer. When an Al2O3 deposition cycle is inserted below the first seed layer, the crystallization of the STO films is disturbed, and the bulk dielectric constant degrades from 149 (undoped STO) to 71. When the Al2O3 deposition cycle is performed after the STO main layer growth, however, the dielectric constant degradation is minimized (120). In both cases, the leakage current decreases 20 times compared with the undoped STO case because of the conduction band offset increase. Consequently, the equivalent oxide thickness and physical oxide thickness decrease from 0.71 to 0.63 nm and from 10.3 to 8.6 nm, respectively, through Al doping on the top of the STO films with a sufficiently low leakage current (<10(-7 )A cm(-2)).
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Collections - College of Engineering > Department of Organic Materials and Fiber Engineering > 1. Journal Articles
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