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Results 1-1 of 1 (Search time: 0.002 seconds).
Nondestructive evaluation of adhesively bonded joints using ultrasonic technique
Yi, W
; Jang, CS; Han, JY; Kim, MG
Conference
Issue Date
2004
Citation
Proceedings of the 11th Asian Pacific Conference on Nondestructive Testing, v.270-273, pp.1833 - 1838
Publisher
TRANS TECH PUBLICATIONS LTD
Place
GE; Jeju Island
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Jang, CS
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Kim, MG
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Yi, Won
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2004
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