ScholarWorks@Soongsil University

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Prediction of delamination resistance in laminated composites with electrospun nano-interlayers using a cohesive zone model

Sihn, S.; Park, J.W.; Kim, R.Y.; Huh, W.; Roy, A.K.

ConferenceIssue Date2006Citation47th AIAA/ASME/ASCE/AHS/ASC Structures, Structural Dynamics and Materials Conference, v.3, pp.2162 - 2171ISBN1563478080PlaceNewport, RI
A W-band VCO using center-tapped basic inductor in 65nm CMOS

Lee, J.; Moon, Y.

ConferenceIssue Date2013Citation2013 International SoC Design Conference, ISOCC 2013, pp.127 - 129PublisherIEEE Computer SocietyISBN9781479911417PlaceBusan
The in-medium effects on the neutrino reaction in dense matter

Cheoun, M.-K.; Kim, K.S.; Saito, K.; Kajino, T.; Tsushima, K.; Maruyama, T.

ConferenceIssue Date2014CitationWorkshop on Dark Matter, Neutrino Physics and Astrophysics, CETUP* 2013 and 7th International Conference on Interconnections Between Particle Physics and Cosmology, PPC* 2013, v.1604, pp.156 - 163PublisherAmerican Institute of Physics Inc.ISBN9780735412385PlaceLead/Deadwood, SD
Drone Detection Using Convolutional Neural Networks with Acoustic STFT Features

Seo, Y.; Jang, B.; Im, S.

ConferenceIssue Date2019Citation15th IEEE International Conference on Advanced Video and Signal-Based Surveillance, AVSS 2018PublisherInstitute of Electrical and Electronics Engineers Inc.ISBN9781538692943PlaceUS
Remanufacturing: A model for products with physical and technological obsolescence

Minjung, K.; Harrison, K.

ConferenceIssue Date2015Citation20th International Conference on Engineering Design, ICED 2015, v.4, no.DS 80-04, pp.135 - 144PublisherDesign Society
SI/PI/EMI analysis of through-via effects on power/ground plane using high dielectric material

Choi, Y.-K.; Cho, S.-G.; Park, M.-S.; Yun, S.-C.; Wee, J.-K.

ConferenceIssue Date2007Citation9th Electronics Packaging Technology Conference, EPTC 2007, pp.425 - 428ISBN1424413249
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ConferenceIssue Date2009Citation한국정치커뮤니케이션학회 봄철정기학술대회, pp.51 - 80Publisher한국정치커뮤니케이션학회PlaceKO; 숭실대학교 법학관
A technique to represent Product Line core assets in MDA/PIM for automation

Min, HG; Kim, SD

ConferenceIssue Date2006Citation2nd International Workshop on Rapid Integration of Software Engineering Techniques, RISE 2005, v.3943, pp.66 - 80PublisherSPRINGER-VERLAG BERLINISBN3540340637PlaceHeraklion, Crete
The standardization of categorizing voice tones by V7B

Kyon, D.-H.; Kim, M.-S.; Bae, M.-J.

ConferenceIssue Date2012Citation6th International Conference on Convergence and Hybrid Information Technology, ICHIT 2012, v.310 CCIS, pp.749 - 755ISBN9783642326912PlaceDaejeon
A realistic illumination model for stained glass rendering

Kim, J.-A.; Ming, S.; Kim, D.

ConferenceIssue Date2007Citation2nd International Conference on Virtual Reality, ICVR 2007, v.4563 LNCS, pp.80 - 87ISBN9783540733348PlaceBeijing
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