Lee, Hyoungsoon; Maitra, T.; Palko, J.; Zhang, C.; Barako, M.; Won, Y.; Asheghi, M.; Goodson, K.E.
ArticleIssue Date2017CitationASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2017, collocated with the ASME 2017 Conference on Information Storage and Processing SystemsPublisherAmerican Society of Mechanical Engineers