An investigation of the reliability of solderable ICA with low-melting-point alloy (LMPA) filler

Abstract

Conductive adhesives play a major role in the electronic packaging industry as an alternative to solder due to their potential advantages that include mild processing conditions and superior thermo-mechanical performance. In a conductive adhesive interconnection, adequate mechanical and electrical performance and long-term reliability are critical. In this paper, the reliability of solderable isotropic conductive adhesive (ICA) interconnections was investigated. Reliability testing was performed via thermal shock (-55 to 125 degrees C, 1000 cycles) and high-temperature and high-humidity tests (85 degrees C, 85% RH, 1000 h). The interfacial microstructure of the solderable ICA was also investigated. Additionally, the fracture mode was investigated via mechanical pull strength testing before and after the reliability test. The electrical resistance of the solderable ICA interconnection showed improved stability compared to conventional ICAs, and similar stability to conventional solder paste (Sn-3Ag-0.5Cu and Sn-58Bi) due to the metallurgical interconnection formed by the molten LMPA fillers between the corresponding metallization layers. After the reliability tests, the grown IMC layer was composed of Cu(6)Sh(5) (eta-phase) and Cu3Sn (epsilon-phase), and the scallop-type IMC transformed into a layer-type IMC. The fracture propagated along the Cu-Sn IMC/SnBi interface and the fracture surface showed a semi-brittle fracture mode mixed with cleavage and ductile tear bands. (C) 2014 Elsevier Ltd. All rights reserved.