Effect of Temperature and Electric Field on Degradation in Amorphous InGaZnO TFTs Under Positive Gate and Drain Bias Stress
- Authors
- Kim, Jong In; Cho, In-Tak; Joe, Sung-Min; Jeong, Chan-Yong; Lee, Daeun; Kwon, Hyuck-In; Jin, Sung Hun; Lee, Jong-Ho
- Issue Date
- Apr-2014
- Publisher
- IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
- Keywords
- InGaZnO; thin-film transistors; degradation; instability; electric field; self-heating
- Citation
- IEEE ELECTRON DEVICE LETTERS, v.35, no.4, pp 458 - 460
- Pages
- 3
- Journal Title
- IEEE ELECTRON DEVICE LETTERS
- Volume
- 35
- Number
- 4
- Start Page
- 458
- End Page
- 460
- URI
- https://scholarworks.bwise.kr/cau/handle/2019.sw.cau/12347
- DOI
- 10.1109/LED.2014.2306818
- ISSN
- 0741-3106
1558-0563
- Abstract
- The mechanism of the electrical degradation in amorphous InGaZnO thin-film transistors under a positive gate and drain bias stress is investigated. The stress tests under various combinations of bias and temperature reveal that the negative shift of transfer curves accompanied by a hump is attributed to not an electric field or heating alone, but the simultaneous effect of them. Furthermore, the mitigated degradation under a pulsed stress of a reduced pulse period from 2 s to 0.1 ms and the difference in output characteristics between a dc sweep and a pulsed sweep measurements imply that self-heating with the high field could be the main cause of the degradation rather than hot-carrier effect.
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