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Degradation of poly(ethylene glycol-propylene glycol) copolymer and its influences on copper electrodeposition
- Authors
- Choe, Seunghoe; Kim, Myung Jun; Kim, Hoe Chul; Lim, Taeho; Park, Kyung Ju; Kim, Kwang Hwan; Ahn, Sang Hyun; Lee, Anna; Kim, Soo-Kil; Kim, Jae Jeong
- Issue Date
- Feb-2014
- Publisher
- ELSEVIER SCIENCE SA
- Keywords
- Copper electrodeposition; Additive; Poly(ethylene glycol-propylene glycol); Decomposition; Cyclic voltammetry stripping
- Citation
- JOURNAL OF ELECTROANALYTICAL CHEMISTRY, v.714, pp 85 - 91
- Pages
- 7
- Journal Title
- JOURNAL OF ELECTROANALYTICAL CHEMISTRY
- Volume
- 714
- Start Page
- 85
- End Page
- 91
- ISSN
- 1572-6657
1873-2569
- Abstract
- In this work, the degradation of poly(ethylene glycol-propylene glycol) copolymer (PEG-PPG) and its effect on the electrodeposition of Cu were investigated. PEG-PPG became fragmented during the electrodeposition with changing its terminal groups from hydroxyl to aldehyde, formic ester, and ketone. The aged solution showed a higher saturation current density than the fresh solution in chronoamperometry (CA) measurements, resulting from an easier desorption of the cleaved PEG-PPG from the copper surface through the competition with bis-(3-sulfopropyl)-disulfide (SPS). Furthermore, the electrical resistivity of Cu films deposited from the aged solution increased due to a decrease in the grain sizes. (C) 2014 Published by Elsevier B.V.
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Collections - College of ICT Engineering > School of Integrative Engineering > 1. Journal Articles
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