Lateral Nanoelectromechanical Relays for Reconfigurable Logic

Abstract

This study proposes novel structures and a novel process for lateral nanoelectromechanical (NEM) relays and experimentally verifies their performance. Lateral NEM relays have a simpler fabrication process and better integration than vertical NEM relays because the latter require multiple metal layers while the former require only one metal layer. Thus, lateral NEM relays integrated over CMOS logic blocks are more advantageous compared to vertical NEM relays for reconfigurable logic applications.