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Characteristics of Graphene-Filled Solderable Isotropically Conductive Adhesive (ICA)open access
- Issue Date
- Mar-2012
- Publisher
- JAPAN INST METALS
- Keywords
- isotropically conductive adhesive (ICA); graphene; low-melting-point alloy; polymeric composites
- Citation
- MATERIALS TRANSACTIONS, v.53, no.3, pp 578 - 581
- Pages
- 4
- Journal Title
- MATERIALS TRANSACTIONS
- Volume
- 53
- Number
- 3
- Start Page
- 578
- End Page
- 581
- ISSN
- 1345-9678
1347-5320
- Abstract
- A new class of functionalized graphene-filled solderable isotropically conductive adhesive (ICA) has been developed using a low-melting-point alloy (LMPA) fillers. The mechanical and electrical characteristics of formulated ICAs were investigated and compared with those of three kinds of conventional ICAs filled with Ag panicles. The functionalized graphene-filled solderable ICA fanned good metallurgical interconnection between upper and corresponding lower electrode. The developed ICA exhibit lower electrical resistance and higher mechanical strength compared with those of conventional ICAs. In addition, the thermal conductivity was improved about 20% by adding functionalized graphene compared with that of solderable ICA without graphene. [doi:10.2320/matertrans.M2011365]
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Collections - College of Engineering > School of Mechanical Engineering > 1. Journal Articles
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