The evaporation and wetting dynamics of sessile water droplets on submicron-scale patterned silicon hydrophobic surfaces
- Authors
- Shin, Dong Hwan; Lee, Seong Hyuk; Choi, Chang Kyoung; Retterer, Scott
- Issue Date
- May-2010
- Publisher
- IOP PUBLISHING LTD
- Citation
- JOURNAL OF MICROMECHANICS AND MICROENGINEERING, v.20, no.5
- Journal Title
- JOURNAL OF MICROMECHANICS AND MICROENGINEERING
- Volume
- 20
- Number
- 5
- URI
- https://scholarworks.bwise.kr/cau/handle/2019.sw.cau/22473
- DOI
- 10.1088/0960-1317/20/5/055021
- ISSN
- 0960-1317
- Abstract
- The evaporation characteristics of 1 mu l sessile water droplets on hydrophobic surfaces are experimentally examined. The proposed hydrophobic surfaces are composed of submicron diameter and 4.2 mu m height silicon post arrays. A digital image analysis algorithm was developed to obtain time-dependent contact angles, contact diameters, and center heights for both non-patterned polydimethylsiloxane (PDMS) surfaces and patterned post array surfaces, which have the same hydrophobic contact angles. While the contact angles exhibit three distinct stages during evaporation in the non-patterned surface case, those in the patterned silicon post array surface case decrease linearly. In the case of post array hydrophobic surfaces, the initial contact diameter remains unchanged until the portion of the droplet above the posts completely dries out. The edge shrinking velocity of the droplet shows nonlinear characteristics, and the velocity magnitude increases rapidly near the last stage of evaporation.
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Collections - College of Engineering > School of Mechanical Engineering > 1. Journal Articles
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