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BCB-based wafer-level packaged single-crystal silicon multi-port RF MEMS switch
- Authors
- Kim, J. -M.; Lee, S.; Baek, C. -W.; Kwon, Y.; Kim, Y. -K.
- Issue Date
- Jan-2008
- Publisher
- INST ENGINEERING TECHNOLOGY-IET
- Citation
- ELECTRONICS LETTERS, v.44, no.2, pp 118 - 119
- Pages
- 2
- Journal Title
- ELECTRONICS LETTERS
- Volume
- 44
- Number
- 2
- Start Page
- 118
- End Page
- 119
- ISSN
- 0013-5194
1350-911X
- Abstract
- A fully wafer-level packaged single-crystal silicon single-pole nine-throw (SP9T) MEMS switch using benzocyclobutene as a packaging adhesive layer is presented. The packaged switch shows an insertion loss of less than 0.6 dB and an average packaging loss of 0.04 dB, and an input to output isolation of better than 35 dB for all of the measured paths with little deviations up to 2 GHz.
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Related Researcher
- Baek, Chang Wook
- 창의ICT공과대학 (전자전기공학부)