The observation and simulation of Sn-Ag-Cu solder solidification in chip-scale packaging

Abstract

The formation of solidification defects in lead-free soldering is greatly influenced by material factors as well as the design of circuit assemblies. To establish ideal processing conditions and design concepts for sound soldering structures, defect formation in Sn-Ag-Cu for various types of circuit assemblies must be understood.. In this study, the solidification process of Sn-Mg-0.5Cu solder balls on circuit boards for a chip-scale package was examined primarily by using an in-situ solidification observation system with the aid of the solidification simulation. Microstructural observations, were also carried out on soldered joints to support those observations and simulations. The experimental results correlate with the simulation results.