3-D highly precise self-alignment process using surface tension of liquid resin material
- Authors
- Kim, JM; Yasuda, K; Shin, YE; Fujimoto, K
- Issue Date
- Jul-2002
- Publisher
- IEICE-INST ELECTRONICS INFORMATION COMMUNICATIONS ENG
- Keywords
- 3-D assembly; fluxless bonding; joint geometry; passive alignment; OE-MCMs
- Citation
- IEICE TRANSACTIONS ON ELECTRONICS, v.E85C, no.7, pp 1491 - 1498
- Pages
- 8
- Journal Title
- IEICE TRANSACTIONS ON ELECTRONICS
- Volume
- E85C
- Number
- 7
- Start Page
- 1491
- End Page
- 1498
- URI
- https://scholarworks.bwise.kr/cau/handle/2019.sw.cau/25106
- ISSN
- 0916-8524
- Abstract
- A novel self-alignment process using the surface tension of the liquid resin for assembly of electronic or opto-electronic devices in 3-D space has been proposed. The vertical alignment can be controlled by using of metal sphere, reducing the necessary precise process control such as solder volumes and external forces, and allowing large tolerances in liquid volume and misalignment. Lateral alignment could be also achieved by making the liquid resin constrained on the 3-dimensional pads on chip and substrate. This study focused on the principle of self-alignment and final alignment accuracy. In addition, the possibility of self-alignment process was verified by analytic numerical method and scaled-up experiment. An average alignment accuracy of less than 0.25 muM has been obtained. It is thought that this process is effective for assembly simply at low process temperature, low cost and without flux in future assembly techniques.
- Files in This Item
- There are no files associated with this item.
- Appears in
Collections - College of Engineering > School of Mechanical Engineering > 1. Journal Articles
Items in ScholarWorks are protected by copyright, with all rights reserved, unless otherwise indicated.